Abstract

Memory reliability, performance and quality are even more critical today as customers utilize greater memory capacities for Big Data Analytics, Cloud Computing, Virtualization, Database and High Performance Computing workloads. Lenovo offers TruDDR5 and TruDDR4 Memory portfolio for ThinkSystem servers which help dramatically improve workload performance.

Introduction

ThinkSystem TruDDR5 and TruDDR4 memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for memory in Lenovo servers. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.
In addition, Lenovo memory DIMMs for servers have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.

High Performance Memory

Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers.

• Persistent Memory

Lenovo ThinkSystem servers configured with Intel Optane Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.

• 3DS RDIMMs

To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.